Note Details

Category: Processing

Bulb dissected (11apr06, c2009,13,57,0,0) Remaining half of bulb wafered: Wafer 1: c2009,14,57,0,0 Wafer 2: c2009,15,57,0,0 Wafer 3: c2009,16,57,0,0 Wafer 4: c2009,17,57,0,0 Wafer 5: c2009,18,57,0,0